Omron’s High Temperature Relays Enable Denser PCB Designs

       Omron Electronic Components Europe has introduced the G3VM S-VSON(L) MOSFET relay, designed for use in semiconductor test equipment, communications equipment, and test and measurement equipment.
       The relay is capable of operating at ambient temperatures up to 125˚C, an improvement over previous versions that were limited to an ambient temperature of 110˚C. As a MOSFET relay, the device is voltage controlled, eliminating the need to select input resistors and freeing up additional board space.
       As devices become smaller and more complex, designers must try to fit more components onto each printed circuit board. However, every electronic component generates heat during operation, which can affect efficiency and reliability.
       The G3VM relay has improved thermal performance, allowing for denser PCB designs. In practical test applications, this allows more tests to be performed simultaneously in less time.
       Thermal performance is also beneficial for smaller applications, as the G3VM can withstand higher heat dissipation without losing efficiency.
       The relay weighs 0.1 g and measures 2.0 mm (L) x 1.45 mm (D) x 1.3 mm (H). The G3VM S-VSON(L) is available in four models with forward input currents ranging from 0.54 mA to 6.6 mA and continuous load currents ranging from 0.4 A to 1.5 A.


Post time: Mar-21-2025